Air-Vac Engineering
Die Bonder
   
   

Surface Mount Rework &
Assembly Systems



DRS25 SMT Rework

DRS25 | DRS25XLT
The DRS25 is a high performance, mid-range industrial standard for lead-free rework and repair of BGA's, CSP's, Flip Chip, 0201's and more.

 

Through-Hole Rework & Selective Soldering Systems



PCBRM15 Through Hole Rework

PCBRM15
The PCBRM15 is the most cost effective choice for lead-free and tin lead through hole rework and selective soldering
.

 

Microelectronics Assembly & Dispensing Systems



ONYX29 Die Bonder

ONYX29DB
The ONYX29 Die Bonder is an ultra precision, semi-automated die assembly and bonding "benchtop" system.

   
   

DRS27 SMT Rework

DRS27
The DRS27 is a large board BGA/SMT rework machine with 70mm to 125mm vision alignment and a high efficiency IR preheater.

 

PHS PCB Preheater

PHS1500/4000
The PHS Stand Alone Preheaters greatly improve rework for hand tools and mini wave modules. Great for lead-free or heat sink assemblies.

 

ONYX500 Micro Dispensing

ONYX500DS
The ONYX500DS is a multi-functional desktop dispensing system with high precision accuracy.

   
   

DRS27XLT SMT Rework

DRS27T.6Z
The DRS27 "XLT" has the same features as the standard DRS27 but adds extra room for high mass and extra large assemblies.

 

PCBRM System Through Hole Rework

PCBRM System 5.2/5.2DSP
The PCBRM Systems have the same features as the PCBRM15 module but add a flexible preheat area for extra large boards up to 20" x 20".

 

ONYX500 Micro Assembly

ONYX500 Benchtop
The ONYX500 Benchtop is an ultra precision, low volume microelectronics assembly, dispensing, and prototyping system.

   
   

ONYX29 SMT Rework

ONYX29
The ONYX29 is a high performance, robotic SMT rework, assembly and production system with unparalleled automation.

 

PCBRM100 Through Hole Rework

PCBRM100
The PCBRM100 is the "Next Generation Solder Fountain Technology" system for lead-free rework of PTH components on large, high thermal mass assemblies.

 

ONYX500 Micro Assembly Cell

ONYX500/520 Production Cell
The ONYX500/520 Cell is a highly automated, customer specific, micro assembly, dispensing, eutectic and ultrasonic bonding production system.

   
   

BGA Rework Nozzles

Nozzle Tooling
For SMT component removal and site cleaning. Standard and Micro Nozzles for DRS25, DRS27 and ONYX29 Systems.

 

Through Hole Rework Flow Wells

Flow Well Tooling
Flow Wells match the lead pattern and determine the size, shape and direction
of solder flow on PCBRM models.

 

ONYX500 End Effectors

ONYX500 Component Matrix
Platforms, assembly and dispense heads, nozzle stations, stack tray feeder unit, transport systems and more.

   
Air-Vac Engineering Company Info