BGA Rework, CSP Rework, SMT Rework: DRS25

ONYX21
SMT Rework
of Small & Medium Boards

The NEW ONYX21 offers many of the same high performance features and capabilities as the ONYX29 but in a smaller, less automated design.

Standard and Micro Site Cleaning

Component Shuttle

Direct View Camera

Key Benefits:
Heating & Cooling
• 2000 watt Top Convection Heater
• 3500 watt Indirect IR Bottom Heater (12" x 12")
• Linear Air Kife rapidly cools down board and solder joints

Vision
• Camera-based Beamsplitter with motorized zoom lens and
programmable green/white LED illumination provides
superior image quality during alignment.
• SFOV provides full viewing of smaller components while
MFOV provides corner-based viewing of components up
to 70mm.

Axis Movements
• Motorized Z and Vision Axis
• Manual X/Y/Theta adjustments
.

Force Measurement
• High precision load cells provide real-time force
measurement for removal, pickup, dipping and placement.

Gas Flow
• Mass Flow Controller provides programmable, closed-loop
gas flow control.

Software/Thermocouple Ports
• Visual MachinesTM Software with Process Development
Wizard creates a new program in 5 simple (prompted) steps.

Interactive Soldering Process, combined with four (4)
thermocouple ports, provides the capability to quicklky
develop new Thermal Profiles including on-the-fly changes.

All ONYX21 Standard Systems include:
• IR Preheater Single Zone 12" x 12" (3500 watts)
• Top Heater (2000 watt)
• Board Cooling System (Air-Knife), programmable
• Cool-Air Injection (Nozzle)
• Motorized Z-Axis Control
• Precision Force Placement SYstem
• Multiple Field of View Vision with Top/Bottom LED
Lighting (X and Y motor drives)
• 70mm Maximum Component size
• 4 Thermocouple Channels
• Adjustable LED Lighting for PCB
• Thermal Tutor Software
• DELL PC/Flat Screen Monitor, KEyboard and Mouse
• Tool Kit and Board Supports

Specifications:
• Machine Weight & Dimensions:
21"W x 36"D x 35"H (530 x 910 x 890 mm)
• Heater, Top: 2000 watt convection
• Heater, Bottom: 3500 watt, 12" x 12", Indirect IR
• Force Measurement: 50 - 3000 grams
• Placement Accuracy: 15 microns
• Maximum Board size: 16"W x 13"D (400 x 300 mm)
• Minimum Board size: 2"W
• Component size:
- Minimum (in vision): .005" (0.1mm)
- Maximum (in vision): 2.75" (70mm)
- Maximum (reflow): 6"

	Options: Site Cleaning System #0029.03.012 • Proprietary system combines heat and vacuum to provide non-contact site solder removal. This is an essential requirement for safe and effective removal of Lead-Free solder form fragile, fine ppitch pads without damaging pads or solder mask. Universal Insertion Tool #AU6LGA47R Mechanically self-centers any square or rectangular device for accurate pick up. Component Pickup & Dipping Shuttle #50.21.006 Provides force-controlled component pickup and flux/paste dipping. Pivoting IR Probe with Laser Pointer #1012.02.017 Provides non-contact board temperature measurement and process control. Direct View Camera System #0027.15.101 Provides magnified, multi-angle viewing of site. Includes camera with zoom and light ring, pivoting camera mount and monitor EZ Nozzle Package #NTSTD Includes 14 EZ Nozzles (5 - 44 mm)