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Air-Vac’s Commitment Heading Into The Future Air-Vac is committed to producing the highest quality rework/repair, selective soldering/desoldering and assembly systems designed with the capability and flexibility required to meet changing customer and industry requirements.
The ongoing technical service and process support that we provide to our customers is a major value-added component of our total product offering.
Our ongoing program of product development and enhancement ensures that Air-Vac will continue to provide innovative leadership for both rework/assembly/selective soldering technology in the electronics industry and vacuum technology in the markets we serve.
We require the involvement and commitment of all company employees working as a team towards these common goals. Everyone is responsible to follow documented policies and procedures, and continually contribute to the improvement of everything we do.
1960: Vacuum Technology Since its founding in 1960, Air-Vac Engineering Company has been an innovator in the development of technical products designed to meet customer needs. The company’s initial product, the Bazooka® Vacuum Sleeve, represented the first use of vacuum technology to prevent scrap from interfering with high-speed die fabrication. Other important initial products included Vacuum Transducer® Pumps and Small Parts Handling Equipment.
1962: Vacuum Desoldering Tools In 1962, Air-Vac introduced the first Hand-Held Vacuum Desoldering Tools to the electronics assembly industry. These products, developed in response to the need to remove molten solder from individual through-hole leads, established Air-Vac as the leader in rework solutions for electronics assembly.
1971: Printed Circuit Board Reflow Module As lead counts began to increase, Air-Vac’s products advanced as well. The PCBRM2 Printed Circuit Board Reflow Module, introduced in 1971, made it possible to reflow multiple through-hole leads simultaneously, increasing the speed of the rework process. Air-Vac’s tooling expertise led to the development of hundreds of solder flow well designs, confirming company leadership in through-hole rework. As assembly and component technology evolved, successive generations of through-hole equipment with expanded features were introduced in response to changing customer needs. The PCBRM15 (lead-free) is Air-Vac's latest technology for through hole rework.
1986: Hot Gas Reflow Module When surface mount technology emerged, Air-Vac again led the industry with the introduction of the DRS21 Hot Gas Reflow Module in 1986. The DRS22, Air-Vac’s first beam-splitter based rework system, was introduced in 1989. The company continues to apply its tooling expertise to developing nozzles and processes for virtually every surface mounted device, including advanced BGA, CSP and Flip Chip packages. The DRS25 is Air-Vac’s latest technology that provides automated, process-controlled rework capability for a broad array of packaging and assembly designs.
1992: Selective Soldering In 1992 Air-Vac recognized that the PCBRM12 was being used for low volume selective soldering as well as rework. In response, the selective soldering capability of this system was enhanced to include spray fluxing, preheat, a motorized carrier and process control software. The PCBRM System was developed to address these selective soldering requirements. The PCBRM System 5.2 is Air-Vac’s latest technology for low volume selective soldering.
1995-2001: Accelerated Growth Air-Vac’s growth accelerated, with the Connecticut-based company more than doubling in size through increased sales, support and process development in the North American market. Underscoring its commitment to ongoing technical and operational support, Air-Vac opened service, training and demonstration centers in Carlsbad, California and Irving, Texas.
2000-2001: Robotic SMT Assembly & Rework Air-Vac's product line continues to advance. The ONYX32 represented Air-Vac's latest technology for providing fully automated processing for area array rework and low volume assembly. The ONYX29 is now Air-Vac’s latest technology in this area.
2003-2005: Lead-Free Technology Air-Vac introduced 2 modules for lead-free rework and selective soldering. The DRS25 Rework System and the PCBRM15, the new standard for lead-free Through-Hole Selective Soldering. Air-Vac also introduced the ONYX29, a robotic, "next generation" BGA/SMT rework system.
2006 The ONYX29, DRS25 and PCBRM15 continue to be the
machines of choice for their respective application
capabilities. 2006-2007
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