BGA Rework, CSP Rework, SMT Rework: DRS25

DRS27
Unparalleled
Precision & Flexibility
for Rework and Assembly of BGA, QFN, CSP, Flip Chip, PoP, 01005 and more

For High Mass and Extra
Large Assemblies,
see the NEW DRS27.6Z

BGA Place

Component Flux

Site Pad Cleaning

Key Features/Benefits:

High Magnification, High Reslolution
State-of-the-Art Vision System
Multiple field-of-view camera allows for extremely close-up viewing of all four corners plus center area of part/location for precision alignment.

Consistent, Precision Vision Alignment
Moveable X/Y head and Fized Board Locations
Assemblies remain at a fixed position in the carrier while the overhead robotic head picks, aligns and places components with an 18 micron placement accuracy.

Automatic Component Pick and Place
Motorized Z-Axis and Theta Rotation
Control motion via front mounted joystick control. Programmable component pick-up and adjustable force placement (grams).

Enhanced Force Placement
Load Cells Measure 20 - 2000 Grams

Programmable Cool Down
Integrated Board Cooling System
Bulit into the carrier, upper cool air injection bypasses heatinig element and air flows directly into nozzle (component).

New Expandable Carrier
Preheaters for all Assembly Sizes
• Standard 3-zone preheater, 16" x 24" (XL assemblies)
•Optional 2-zone preheater, 16" x 16"

Excellent Thermal Uniformity
High Efficiency IR Preheater
• Insulated heating elements provide ultra-fast heat up
(+/- 5 degrees C).
• Black ceramic, high emissivity coating dramatically increases radiant energy to produce the significantly higher preheat temperatures required for lead-free rework.
• Excellent for high thermal mass, military type assemblies
(metal frames).

Flexible Bottom-Side Clearance
User Adjustable
Keep close for better performance - move away for up to 1.62" bottom-side clearance.

User-Friendly Software
8 Thermocouple Channels
Profile assemblies with Thermal Tutor Software. "On-the-fly" temperature and air flow adjustments are standard. Profile library and master thermal templates are part of the software package.

All DRS27 Standard Systems include:
• 3-Zone, High Efficiency 16" x 24" IR Preheater
(7500 watts total)
• Programmable Board Cooling System (Air-Knife)
• 2000 Watt Top Heater
• Cool-Air Injection (Nozzle)
• Motorized Z-Axis and Theta Control
• Multiple Field of View Vision with Top/Bottom LED
Lighting, (X and Y motor drives)
• 70 mm maximum component size
• Board Carrier size 18"W x 24"D
• Joystick operation for all motor controls
• 8 Thermocouple Channels
• Welded Steel Frame with Side Table
• Adjustable LED Lighting for PCB
• Thermal Tutor Software
• DELL PC/Flat Screen Monitor, KEyboard and Mouse
• Tool Kit and Board Supports

Also available:
DRS27-2Z with:
• 2-Zone, High Efficiency 16" x 16" IR Preheater
(5000 watts total)

	Options: Pivoting IR Probe with Laser Pointer #0029.11.041 • Provides process repeatability by insuring that the board is at the exact same target temperature each time. Site Cleaning System #0029.03.012 • Includes Standard and Micro nozzles for complete removal of site solder. Universal Insertion Tool #AU6LGA47R Mechanically self-centers any square or rectangular device for accurate pick up. Direct View Camera #0027.15.010 • Provides high magnification site viewing. Dipping Kit for Solder Paste or Flux #FASET1 • Superior to applying paste via component or board stencils. Ergonomic Workstation with CPU Holder #1003.05.010 Monitor Stand Option for Workstation #1003.05.005 Nozzle Stand Option for Workstation #1003.05.006 Locking Drawer Option for Workstation #1003.05.007 70 mm Topside Clearance (Std is 30mm) #0029.01.052 Fume Extraction Manifold #300.00.547 Air Purification Unit #1020.01.105 Paste-On-Device Stencil Adapter #0024.24.111 4 Additional Thermocouple Ports #300.00.504 Colored LED Lighting