Over 4,000 designed and manufactured since 1988.
All nozzles are interchangeable between ONYX and DRS systems. Air-Vac provides its customers with the world's most advanced nozzle technologies including hot gas, hot bar and heat through nozzle designs. Our ability to provide innovative nozzle solutions for even the most challenging applications is a major competitive advantage.
>Universal BGA/CSP Nozzles that are readily available:
click here
>Nozzle Data sheets available for the following components:
BGA's - MBGA, CSP, C4, Flip Chip (<6mm)
BGA's - PBGA (plastic)
BGA's - TBGA (tape)
BGA's - CBGA/CCGA (ceramic ball/column)
BGA's - SBGA/ESBGA (super/enhanced)
>For Nozzle Data sheets on the following, please contact Air-Vac.
• BGA's - MBGA, CSP, C4, Flip Chip (>6mm)
• BGA's - Sockets & Connectors
• Carrier's - PLCC (plastic leaded chip)
• Carrier's - LCC (leadless chip)
• Carrier's - LCCJ (leaded chip J-bend)
• Carrier's - TAB (tape packages)
• Connector's - NexLev
• Connector's - Mictor Right Angle
• Connector's - Mictor Vertical
• Connector's - Surface Mount
• Integrated Circuit's - SOIC (small outline) Outline Packages -
TSOP (thin small) Outline Packages - SSOP (shrink small)
• QFP's - PQFP (plastic)
• QFP's - BQFP (bumper)
• QFP's - Hot Bar Nozzles
• QFP's - TQFP (thin)
• Socket's - PLCCS (plastic)
• Miscellaneous - Passive
• Miscellaneous - Odd Shape/Sizes
• Miscellaneous - Multi-Chip Modules
• Integrated Circuit's - SOJ (small outline J-lead)
>For Nozzles for smaller or larger components than those listed, please contact Air-Vac.
>If you know your Air-Vac nozzle part number, click here for a quote.
>If you require a nozzle that is not listed, or are having trouble determining which style nozzle best suits your application, please click here and send a Manufacturers Mechanical Drawing (PDF) of your Component.
>For Site Cleaning Nozzles click here
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