BGA Rework, CSP Rework, SMT Rework: ONYX29

ONYX29
Advanced SMT Production Rework & Assembly

The new ONYX29 provides an unparalleled level of automation and process control for SMT rework and assembly. The new Tool Changer automatically selects and changes nozzles based on program instructions. The new Pick & Prep station provides automatic component pick up and preparaton including flux dipping, paste on device and solder paste dipping. The new Process Development Wizard automatically creates a complete rework process based on user response to five structured prompts. Other key functions include fully automated non-contact site cleaning, force-controlled auto placement and motorized vision/zoom.

ONYX29 Applications
Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.

Automated 01005 Rework

Small Board Rework more info>

Key Benefits:
• 9 micron placement accuracy (0.0003”) @ 3 Sigma
• High volume rework
• Ultra-fast heat up for Lead-Free Rework
• Fast, controlled board cool down
• Process repeatability
• Uniform joint temperature
• Precision air flow
• Simple, fast & easy to use software
• Large, clear images for component alignment
• Components up to 3.0” (75mm)
• Micro site cleaning
• Clean and uniform pads for replacement device
• Solder dots or lines down to 0.010”
• Dispensing of solder paste, epoxy, under fill or flux"

Key Specifications:
• Board size minimum = 3.0"W
• Board size maximum = 20.0"W x Unlimited
• Top and bottom side clearance = 1.20" (optional 2.75")
• Bottom heating: 19" x 19", 4 zones, 6000 watts
• Axes speed (X,Y,Z) = .15 ms
• Axes resolution (X,Y,Z) = .001 mm

0201 Removal

Fully Automated Site Cleaning

Micro Leaded Component

Features/Benefits:
Lead-Free Requirements
• Powerful 2000 watt top heater.
• Infra-red (IR) bottom heating technology. The heating element provides extremely uniform preheat over the entire surface. The bottom heating panel is 19" x 19" and features four (4) independently programmable heating zones (6000 watts).
• Programmable cold air injection and linear air knife provide precise cool down control to optimize time over reflow.
• Interactive thermal profiling provides "on-the-fly" adjustments.

Seven Axes of High Automation
• Control of X, Y, Z, Theta, Vision Zoom, Vision X & Vision Y.

Multiple Field of View (MFOV)
• Automatically indexes the camera to the four corners of large components up to 75mm.

Automated Precision Component Pick-Up
• Multi-position pick capability from large and small waffle trays, gel packs, tape and reel, and single component nest.
• Precision Micro-Force sensing provides the extremely low force needed to pick tiny, fragile devices.

Dispensing Technology
• Rework and low volume assembly of emerging technology typically requires integrated precision dispensing of solder paste, flux, epoxy or underfill.

Proprietary Non-Contact Site Cleaning
• NEW Micro Tip Site Clean Assembly (#1015.11.059) with a high temp, non-abrasive, composite vacuum micro tip with an inside diameter of 0.063".
• Composite vacuum tip with automatic height adjustment, automatically compensates for variable residual solder volume.
• Eliminates potential damage to pads or solder mask caused by contact-based methods.
• Especially critical for removal of Lead-Free solder with higher reflow temperature and for micro site cleaning of small, fragile pads/solder mask. Programmable micro tips remove solder from small sites without affecting adjacent devices.
• Powerful heat and vacuum, combined with high efficiency bottom heating, can also remove solder from barrels of through hole and Mictor connectors.
• Conductive heating/vacuum tips remove solder from 0201 and other pads where convective site cleaning can not be used.

Visual MachinesTM Software
• Graphical user interface provides a visual representation of the board and component locations to the operator. One or multiple component sites can be reworked during a single cycle.
• Expanding component library includes ready-made process sequences and thermal parameters for
Tin/Lead and Lead-Free components.

	Options: Pivoting IR Probe with Laser Pointer #0029.11.041 • Provides process repeatability by insuring that the board is at the exact same target temperature each time before localized reflow begins. • Operator is instructed to position the sensor at the beginning of the process. • Laser point provides a visual reference to the center of the IR sensor verifying position over the substrate at the same location as profiled. • Pivot function allows positioning on small boards without interference of the nozzle heating throughout the rework processes. • Non-contact temperature sensor monitors topside board temp and triggers localized reflow process once the target temperature is reached.

	Automatic Tool Changer with Component Pick, Prep & Drop • ProvidesaAdditionalaAutomation &pProcesscControl • Eliminates manual handling of hot nozzles • Provides permanent locations & easy access for: - Single component or multi-component pick stations - Component dip stations (tacky flux or new dippable solder paste) - Component drop off station • Micro-force controlled component pick & prep • Industrial grade steel design (each pocket arm weighs 14 lbs) • Five pocket (#0029.14.010) or ten pocket system (#0029.14.011)

	High Throughput Carousel Fixture for Small Board Rework #0029.15.041 • Rework capacity and process control for small boards can be substantially increased by the addition of the four-zone, high throughput carousel fixture.

	Component Shuttle #0029.02.042 • Provides a safe, repeatable location for component pick up, flux dipping and drop off away from the heated work area. • Eliminates manual component loading/removal in the heated work area. • Software-controlled pneumatic shuttle enters the work area for pick up, flux dipping or drop off, then exits the work area. • Shuttle-based component pick up and flux dipping is set and monitored with machine force placement system. • Multi-location pick and flux dipping capability for multi-processing of small devices (custom tooling required).

	Site Cleaning System #0029.03.012 • Includes Standard and Micro nozzles. • High temperature composite vacuum tip eliminates metal-to-metal contact. • Vacuum sensor automatically and continuously adjusts tip height, providing non-contact site cleaning. • Various size heating noses and tips to clean virtually any site. • Ready-to-use site cleaning programs for fully automated solder removal.

	Direct View Camera with 20" Video Monitor #0029.04.041 • Provides high magnification site viewing including the ability to verify when component reflow has occurred. • Operator is instructed to position the camera on the site. Focus, zoom, and lighting adjustments are made to optimize clarity. The image is displayed on a flat screen monitor. • A process development aid especially for difficult to see tiny solder joints. • Recommended for use in conjunction with the automatic site cleaning system to verify cleaning on dense assemblies and for the dispensing option to provide dispense inspection capability.

	Dispensing System #0029.08.010 • Provides on-machine dispensing of flux, solder paste, adhesive, epoxy or underfill. • Proprietary time/pressure dispenser features automatic pressure compensation and programmable vacuum adjustment for accurate and repeatable results. • Uses precision DL Technology dispense needles. • Automatic pattern generation software to easily create dispensing patterns • Note: dispensing requires ambient machine/ assembly temperature. Nozzle cool air injection and the board cooling system can be simultaneously activated to prepare the machine and assembly for dispensing, however this in not practical from a time standpoint for each individual rework process. • The on-machine dispense option is typically used in either a batch mode or for low volume, specialty applications.

	Dipping Kit for Solder Paste or Flux #FASET1 • Superior to applying paste via component or board stencils • Easier process, less operator involvement than stencils (consistent results) • No component or board/pad coplanarity preparation issues • No adjacent interference issues • Excellent for extremely fine pitch, sphere or leaded size components • One set of dipping pedestals replaces dozens of custom component stencils

	Ergonomic Workstation with CPU Holder #1003.05.010 Monitor Stand Option for Workstation #1003.05.005 Nozzle Stand Option for Workstation #1003.05.006 Locking Drawer Option for Workstation #1003.05.007 • Workstaton provides a self contained work cell environment for the machine and operator. Dimensions are 60"W X 36"D. Very sturdy construction with anti-static laminate surface. (Workstation includes CPU holder, everything else is an add on option).

	Universal Insertion Tool #AU6LGA47R • Mechanically self-centers any device for accurate pick-up. Used in conjunction with the automatic component shuttle.

	70mm (2.75") Topside Clearance #0029.01.052 (standard is 30mm) • Provides increased top side clearance for assemblies with vertical daughter cards or tall devices that exceed the standard 30mm (1.2”) top side clearance. Fume Extraction Manifold #300.00.547 • Removes flux vapors for operator health and safety. • Includes fume extraction manifold and hose assembly. • Requires connection to a central exhaust or self-contained filtering system. Four Additional Thermocouple Ports #300.00.504 Thermocouple Organizer #0024.90.047