PCBRM15: Through Hole Rework & Selective Soldering

	PCBRM15 Lead-Free Selective Soldering & Rework of Through-Hole Components
	The PCBRM15 provides precision operation control for Lead-Free and thermally challenging through-hole assemblies. Major advantages include minimal copper dissolution and board delamination, fast and uniform heating, precision alignment, quick component removal/soldering and trouble-free operation. A Simple Controlled Operation Components are accurately located over a wave of solder whose shape matches the lead pattern. Solder flows for seconds against the bottom of the board, transmitting heat to the leads. When joints are molten, the component is removed. Holes are cleaned with low pressure air and the new component is inserted and resoldered.

Directional Solder Flow

Multi Component Desoldering

Precision Board to Wave Contact

Key Benefits:
• Lead-Free and thermally challenging assemblies
• Minimal Copper dissolution in PCB barrels
• Minimal board delamination
• Fast and uniform heating
• Precise operating controls and alignment system
• Quick component removal and soldering
• Product reliability, simple design, trouble-free operation

Specifications:
• Physical Dimensions: 32”W x 32”D x 26”H
• Solder Capacity: 35 lbs. Weight with Solder: 125 lbs.
• Compressed Air: 40-80 psi, clean moisture free
• Electrical: 208/220V, 15 amps @ 220V, 50/60Hz
single phase, 2500 watts.

Features/Benefits:
Precise Operating Control
• Solder Wave Contact:
Cycle duration automatically sets time solder contacts board.
• Solder Wave Flow Rate:
Allows level wave for any flow well shape or size. Three (3) stage settings for enhanced process control.
• Temperature:
Closed-loop control of set temperature. System can be set to 615°F (325°C).

Pumping System & Solder Pot
• Cast iron solder pot and titanium/cast iron impeller pump
are designed to withstand aggressive, lead-free solder.
• Minimal dross accumulation and level solder wave.

Alignment System
• X, Y, Z Board Carrier - Cantilever rails, linear bearings
and rigid cast framework provides large board holding,
precision rail movement and continuous usage.
• PCB Hole Cleaning System (option) - Component is
aligned over solder wave then cleaning hood is
positioned to clean PCB barrels.

Titanium Flow Wells
• Solder flow is directed away from adjacent components.
• High pin count leads are heated simultaneously for a
quick process.
• Locating pins position the lead pattern over the wave.
• External heaters maintain uniform heat on large wells.
• Fixtures for multiple and irregularly shaped boards.

	Options: • Flow Well Heater Control Module (ST350) • Air Cleaning System (APS) • Fume Extraction Manifold (3005.02.040) Recommended Spare Parts • Drive Belt (high temp) (12467) • Pump Bearing (set of 2) (9001.09.020) • Thermocouple & Fitting (process) (12801) Thermocouple & Fitting (overtemp) (12802)