Air-Vac
 
 

QFN/MLF Reballing (Pasting) Kit
Paste Twenty Devices at a Time		   QFN group

Speed up your rework production!

  

How It Works
The Interposer or Capture Plate is placed onto the Vacuum Fixture, aligned using the tooling pins. Twenty QFN/MLF devices are then loaded into the Interposer. The Stencil Frame is mounted over the components and solder paste is then squeeged evenly across. The Vacuum Module is activated and the Stencil Frame is removed. Components are now ready to be reflowed using a hot plate, hot gas tool, or IR heater.

*Patents Pending







QFN Reballing Kit

  
 
Download Literature here

For more information, email or fax a specification sheet of your QFN/MLF device to Air-Vac.		      
 



     
 
  Copyright 2009 Air-Vac Engineering